Director, Package Developement (opens in new tab)
Amkor Technology · View all jobs
Tempe, Arizona, United States (Hybrid) · Posted 30+ days ago
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Industry Semiconductor
Job Function Electrical Engineer
Job Type Full-Time
Job Duration Indefinite
Min Education BA/BS/Undergraduate
Min Experience Over 10 Years
Required Travel 0-10%
Director, Package Developement

The insights provided are generated by AI and may contain inaccuracies. Please independently verify any critical information before relying on it.
Director, Package Developement
The insights provided are generated by AI and may contain inaccuracies. Please independently verify any critical information before relying on it.

About this role

Position Summary:
Amkor is seeking a senior Director of Advanced Packaging and Wafer Services for the Tempe, AZ office. This role will provide strategic and technical leadership for the development and commercialization of advanced wafer-based IC package platforms, including HDFO, 2.5D, chiplet-based architectures, and other leading-edge package constructions for computing, networking, AI, and mobile market segments. The successful candidate will serve as a senior customer-facing leader and primary interface with Tier 1 customers, Amkor's global R&D centers, and cross-functional business and engineering teams to drive technology roadmaps, program execution, and successful transition from development into production ramp.

 Essential Duties and Responsibilities:

  • Lead strategic customer engagements and development programs with Tier 1 customers, aligning customer requirements with Amkor's advanced packaging technology roadmap.
  • Drive and coordinate development activities with Amkor's R&D teams in Korea and other global engineering organizations to ensure timely execution of advanced package programs.
  • Serve as the senior technical and program interface for customer meetings, executive reviews, technical discussions, issue resolution, and follow-up actions during the development and qualification phases.
  • Lead cross-functional teams across R&D, design, characterization, simulation, process engineering, product management, operations, suppliers, and business development to execute complex advanced packaging programs.
  • Own customer product management through concept definition, feasibility assessment, development, qualification, and initial production ramp.
  • Guide technical tradeoff decisions related to package architecture, wafer process integration, design rules, materials, reliability, manufacturability, cost, schedule, and yield risk.
  • Lead key engagements with ecosystem partners and wafer processing suppliers to influence technology choices, supplier readiness, and future roadmap direction.

Key Requirements

  • Required Qualifications:
  • Bachelor's degree in Engineering required; Master's degree or Ph.D. preferred.
  • 10+ years of experience in semiconductor package development, wafer-level packaging, IC packaging, or wafer process technology.
Job ID: 85917011

About the company

Amkor Technology
Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level process…
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