Description

Samtec, Inc.


Position Title: Principal Optoelectronic Packaging Engineer

Description

• Research & Innovation: Research and analyze emerging material and process technologies within a roadmap connecting capabilities and products.
• Architecture Development: Guide the physical architecture of advanced optoelectronic packages based on a broad knowledge of interconnect technologies (RDL, wire bonding, flip chip, solder, conductive adhesives, etc.) materials (semiconductors, glass, laminates, ceramics, polymers, adhesives, etc.), and automated assembly techniques (SMT, wire bonding, die attach, curing, thermal bonding, spot curing, solder reflow, epoxy dispense, etc.)
• Process Development: Lead the development and integration of assembly processes in R&D, prototyping, and volume production environments. Apply Six Sigma methodologies (DMADV) and FMEA to design and document new processes. Ensure optical module reliability by conducting necessary testing to meet commercial and military standards.
• Process Transfer: Interface with internal and external operations teams, collaborating closely with production teams on equipment and process improvements. Transfer scalable processes to manufacturing operations, both domestic and international.
• Mentorship: Mentor process development engineers on DOE (Design of Experiments) techniques, failure analysis, and operation of automated and mechanized equipment to support package builds for low, medium, and high-volume production.
• Collaboration: Work closely with marketing, process engineering, and R&D teams to align goals and realize outcomes.

• Experience:
• 15-25 years of experience building optoelectronic packages in a manufacturing environment.
• 10+ years conducting research on new materials and processes.
• 10+ years developing processes on automated and semi-automated equipment.
• Direct experience working in a manufacturing environment, including familiarity with cleanroom protocols and equipment.
• Technical Expertise:
• Extensive knowledge of materials, interconnect technologies, equipment, and process development for optoelectronic module assembly.
• Deep understanding of automated and mechanized equipment used semiconductor packaging and assembly.
• Familiarity with 3D printing using polymers for various applications.
• Solid understanding of optical module reliability and testing protocols.
• Soft Skills:
• Strong communication skills: Excellent written, verbal, and presentation abilities.
• Independent problem-solver with the ability to work within a multi-disciplinary engineering environment.
• Highly organized with the capacity to manage multiple priorities effectively.
• Proficient in Microsoft products with the ability to adapt to new software.

• BS or MS in Electrical, Materials, Chemical, or Mechanical Engineering or an equivalent degree.

SAMTEC, Inc. is an Equal Opportunity Employer and committed to creating a diverse environment. All employment decisions at Samtec are based on business needs, job requirements and individual qualifications, without regard to race, color, religion or belief, national, social or ethnic origin, pregnancy or parental status, age, disability, sexual orientation, gender and/or gender identity/expression, marital status, past or present military service, family medical history or genetic information, or any other status protected by applicable laws.

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